Niche-Tech

Copper Bonding Wire

Advanced packaging technology is recognized as an essential ingredient in delivering cost-effective semiconductor solutions to a variety of electronic applications today.
Niche-Tech Copper (Cu) bonding wire offers significant cost advantage over Gold (Au) bonding wire. Our Cu bonding wire is an excellent replacement for Au bonding wire due to its similar electrical properties and the cost advantages.

Self inductance and self capacitance are nearly the same and Cu bonding wire has lower resistivity. In applications of QFP, QFN and SOIC where resistance due to bond wire can negatively impact circuit performance, using Niche-Tech Cu bonding wire can offer better improvement. Also, a tailor-made concept of Niche-Tech is partnering with various interested parties for advanced packaging to continue to expand knowledge and lead technology development.

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